DeWitt LLP Welcomes Seasoned Intellectual Property Attorney Brian Pollack to its Growing Team

Today, DeWitt LLP announced attorney Brian Pollack joined the firm’s growing intellectual property team in its Minneapolis office.

Pollack specializes in patent prosecution and litigation, as well as trademark prosecution and counseling.  His background in engineering gives him a unique perspective and a thorough understanding of the technical aspects of patent law. He represents clients in a wide range of industries including medical devices, manufacturing, medical imaging and computer software.

He has an impressive educational background.  Pollack earned a J.D. from Boston College Law School, an M.S. in Mechanical Engineering and an M.S. in Nuclear Engineering from Massachusetts Institute of Technology and a B.S., magna cum laude, in Mechanical Engineering from Manhattan College.

He is admitted to practice in Minnesota, New York, Massachusetts, Connecticut, the U.S. Court of Appeals for the Federal Circuit Court, the U.S. District Court for the Eastern and Southern Districts of New York, the U.S. District Court for the District of Connecticut and the U.S. Patent & Trademark Office (USPTO).

He is a member of the American Society of Mechanical Engineers (ASME), the American Nuclear Society and the American Chemical Society.

About DeWitt

DeWitt LLP was founded in 1903 and is one of the 10 largest law firms based in Wisconsin, with an additional presence in Minnesota.  It has more than 130 attorneys practicing in Green Bay, Madison and Greater Milwaukee, Wisconsin and Minneapolis, Minnesota, and has the experience to service clients of all scopes and sizes.  The firm is known for its work in a variety of legal areas including background screening, business law, employee stock ownership plans, employee benefits, intellectual property, patents, trademarks and copyright law, construction litigation, employment relations, environmental, estate planning, family business, family law, litigation, real estate, tax law, and more.  Additional information is available at